Author:
Agyeman Michael Opoku,Ahmadinia Ali,Shahrabi Alireza
Subject
Artificial Intelligence,Computer Graphics and Computer-Aided Design,Computer Networks and Communications,Hardware and Architecture,Theoretical Computer Science,Software
Reference27 articles.
1. Impact of three-dimensional architectures on interconnects in gigascale integration;Joyner;IEEE Transactions on Very Large Scale Integration (VLSI) Systems,2001
2. Design issues and considerations for low-cost 3-d tsv ic technology;Van der Plas;IEEE Journal of Solid-State Circuits,2011
3. A.-M. Rahmani, P. Liljeberg, J. Plosila, H. Tenhunen, BBVC-3D-NoC: an efficient 3D NoC architecture using bidirectional bisynchronous vertical channels, in: IEEE Computer Society Annual Symposium on VLSI (ISVLSI), 2010, pp. 452–453.
4. Networks-on-Chip in a three-dimensional environment: a performance evaluation;Feero;IEEE Transactions on Computers,2009
Cited by
10 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献