Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

Author:

Van der Plas Geert,Limaye Paresh,Loi Igor,Mercha Abdelkarim,Oprins Herman,Torregiani Cristina,Thijs Steven,Linten Dimitri,Stucchi Michele,Katti Guruprasad,Velenis Dimitrios,Cherman Vladimir,Vandevelde Bart,Simons Veerle,De Wolf Ingrid,Labie Riet,Perry Dan,Bronckers Stephane,Minas Nikolaos,Cupac Miro,Ruythooren Wouter,Van Olmen Jan,Phommahaxay Alain,de Potter de ten Broeck Muriel,Opdebeeck Ann,Rakowski Michal,De Wachter Bart,Dehan Morin,Nelis Marc,Agarwal Rahul,Pullini Antonio,Angiolini Federico,Benini Luca,Dehaene Wim,Travaly Youssef,Beyne Eric,Marchal Paul

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

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