Shear thickening and defect formation of fumed silica CMP slurries
Author:
Publisher
Elsevier BV
Subject
Colloid and Surface Chemistry
Reference44 articles.
1. Fundamentals of slurry design for cmp of metal and dielectric;Singh;MRS Bull.,2002
2. The use of monodispersed colloids in the polishing of copper and tantalum;Lu;J. Colloid Interface Sci.,2003
3. Effect of slurry ionic salts at dielectric silica cmp;Choi;J. Electrochem. Soc.,2004
4. Chemical mechanical planarization for microelectronics applications;Zantye;Mater. Sci. Eng. Rep.,2004
5. Colloid aspects of chemical-mechanical planarization;Matijevic;J. Colloid Interface Sci.,2008
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