Study on the affecting factors of material removal mechanism and damage behavior of shear rheological polishing of single crystal silicon carbide
Author:
Publisher
Elsevier BV
Reference43 articles.
1. Material science and device physics in SiC technology for high-voltage power devices;Kimoto;Jpn J Appl Phys,2015
2. Hydrogen retention and affecting factors in rolled tungsten: thermal desorption spectra and molecular dynamics simulations;Chen;Int J Hydrogen Energy,2023
3. Current status and recent research achievements in SiC/SiC composites;Katoh;J Nucl Mater,2014
4. Material removal mechanism and grinding force modelling of ultrasonic vibration assisted grinding for SiC ceramics;Li;Ceram Int,2017
5. High efficient polishing of sliced 4H-SiC (0001) by molten KOH etching;Zhang;Appl Surf Sci,2020
Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Molecular dynamics simulation and experimental study of the material machinability characteristics and crack propagation mechanisms for fused silica double nanoscratches;Tribology International;2024-11
2. Performance of flexible CeO2 composite abrasive in force rheological polishing of fused silica glass;Journal of Manufacturing Processes;2024-09
3. Novel photocatalysis-assisted mechanical polishing of laser cladding cobalt-based alloy using TiO2 nanoparticles;Powder Technology;2024-08
4. Material removal modes and processing mechanism in microultrasonic machining of ball ceramic tool;Ceramics International;2024-08
5. Numerical simulation and experimental researches on different abrasive grain arrangements of monolayer diamond grinding tools fabricated by HFCVD method;Journal of Manufacturing Processes;2024-08
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3