Thermal diffusivity of Sn–Ag–Cu-based, Pb-free, micro- and nano-sized solder balls
Author:
Publisher
Elsevier BV
Subject
Physical and Theoretical Chemistry,Condensed Matter Physics,Instrumentation
Reference18 articles.
1. Transient fracturing of solder joints subjected to displacement-controlled impact loads
2. Shear strength and interfacial microstructure of Sn–Ag–xNi/Cu single shear lap solder joints
3. Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn–Ag solder and Au/electroless Ni(P)/Cu bond pad
4. Advances in lead-free electronics soldering
5. Microstructural modifications and properties of Sn-Ag-Cu solder joints induced by alloying
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2. Direct Printing of 1-D and 2-D Electronically Conductive Structures by Molten Lead-Free Solder;Materials;2016-12-22
3. Determination of the enthalpy of fusion and thermal diffusivity for ternary Cu 60 − x Sn x Sb 40 alloys;The Journal of Chemical Thermodynamics;2016-04
4. Low-Temperature Metal^|^#8211;Metal Bonding Process Using Leaf-Like Aggregates Composed of CuO Nanoparticles;Journal of Chemical Engineering of Japan;2015
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