Microstructural modifications and properties of Sn-Ag-Cu solder joints induced by alloying-Reference-Cited by-同舟云学术

Microstructural modifications and properties of Sn-Ag-Cu solder joints induced by alloying

Published:2002-11 Issue:11 Volume:31 Page:1166-1174
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Anderson I. E.,Cook B. A.,Harringa J.,Terpstra R. L.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-002-0006-x.pdf

Reference17 articles.

1. C.M. Miller, J. Electron. Mater. 23, 595 (1994).

2. J. Bath, C. Handwerker, and E. Bradley, Circuits Assembly, p. 31 (May 2000).

3. Challenges and Efforts Toward Commercialization of Lead-free Solder-Road Map 2000 for Commercialization of Lead-free Solder, ver. 1.2, The Japan Electronic Industry Development Association, Lead-free Soldering R&D Project Committee, February 2000; http://www.jeida.or.jp/english/information/pbfree/roadmap.html.

4. I.E. Anderson, J.C. Foley, B.A. Cook, J.L. Harringa, R.L. Terpstra, and O. Unal, J. Electron. Mater. 30, 1050 (2001).

5. I.E. Anderson, K. Kirkland, and W. Willenberg, Surf. Mount Technol. 14, 78 (2000).

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