A study of micro-scale solder bump geometric shapes using minimizing energy approach for different solder materials-Reference-Cited by-同舟云学术

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A study of micro-scale solder bump geometric shapes using minimizing energy approach for different solder materials

Published:2022-11 Issue:6 Volume:13 Page:101769
ISSN:2090-4479
Container-title:Ain Shams Engineering Journal
language:en
Short-container-title:Ain Shams Engineering Journal

Author:

Aziz bin Mohd Yusof Ab,Al Fatihhi Mohd Szali Januddi Mohd,Noor Harun Muhamad

Publisher

Elsevier BV

Subject

General Engineering

Reference39 articles.

1. An overview of Pb-free, flip-chip wafer-bumping technologies;Kang;JOM,2008

2. RF characterization and modeling of various wire bond transitions;Lim;IEEE Trans Adv Packag,2005

3. Thermo-mechanical analysis of TSV and solder interconnects for different Cu pillar bump types;Park;Microelectron Eng,2012

4. Fluid/structure interaction analysis of the effects of solder bump shapes and input/output counts on moulded packaging;Khor;IEEE Trans Compon Packag Manuf Technol,2011

5. IEEE 61st electronic components and technology conference (ECTC);Gerber;IEEE,2011

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Solder joint shape optimization and thermal-mechanical reliability improvement for microwave RF coaxial connectors;Microelectronics Reliability;2024-03

2. Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review;Materials;2023-12-14

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