Author:
Kawata Hiroaki,Matsue Masato,Kubo Kensuke,Yasuda Masaaki,Hirai Yoshihiko
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference9 articles.
1. Study of the demolding process—implications for thermal stress, adhesion and friction control
2. H. Kawata, K. Okuda, K. Sogou, N. Niimi, M. Yasuda, Y. Hirai, in: Digest of Papers MNC 2006, Kamakura, Japan, 2006, p. 360.
3. Challenges, developments and applications of silicon deep reactive ion etching
4. Critical tasks in high aspect ratio silicon dry etching for microelectromechanical systems
5. Si Etching with High Aspect Ratio and Smooth Side Profile for Mold Fabrication
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