Resist behaviour during peeling release in nano-imprint lithography-Reference-Cited by-同舟云学术

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Resist behaviour during peeling release in nano-imprint lithography

Published:2016-05-10 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
language:
Short-container-title:

Author:

Chalvin Florian,Nakamura Naoto,Tochino Takamitsu,Yasuda Masaaki,Kawata Hiroaki,Hirai Yoshihiko

Publisher

SPIE

Reference32 articles.

1. Nanoimprint lithography

2. Mold Surface Treatment for Imprint Lithography.

3. Step and flash imprint lithography: Template surface treatment and defect analysis

4. Vapor-Phase Self-Assembled Monolayer for Improved Mold Release in Nanoimprint Lithography

5. Novel thermoplastic polymers with improved release properties for thermal NIL

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Adhesion improvement of photoresist: destruction mode analysis;Advances in Patterning Materials and Processes XXXVII;2020-03-23

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