Potential and limitations of a T-NIL/UVL hybrid process-Reference-Cited by-同舟云学术

Potential and limitations of a T-NIL/UVL hybrid process

Published:2010-05 Issue:5-8 Volume:87 Page:851-853
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Scheer H.-C.,Wissen M.,Bogdanski N.,Möllenbeck S.,Mayer A.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference13 articles.

1. Influence of pattern density in nanoimprint lithography

2. Nanoimprint- and UV-lithography: Mix&Match process for fabrication of interdigitated nanobiosensors

3. Mix and match of nanoimprint and UV lithography

4. Negative UV–NIL (NUV–NIL) – A mix-and-match NIL and UV strategy for realisation of nano- and micrometre structures

5. An electron‐beam/optical‐hybrid lithography approach to submicrometer electronic devices

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