Influence of pin offset in PCB through-hole during wave soldering process: CFD modeling approach-Reference-Cited by-同舟云学术

Influence of pin offset in PCB through-hole during wave soldering process: CFD modeling approach

Published:2013-11 Issue: Volume:48 Page:116-123
ISSN:0735-1933
Container-title:International Communications in Heat and Mass Transfer
language:en
Short-container-title:International Communications in Heat and Mass Transfer

Author:

Aziz M.S. Abdul,Abdullah M.Z.,Khor C.Y.,Ani F. Che

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Chemical Engineering,Atomic and Molecular Physics, and Optics

Reference13 articles.

1. Case study for high volume lead-free wave soldering process with environmental benefits;Baylakoglu;ISEE,2005

2. Application of self-organizing maps in analysis of wave soldering process;Liukkonen;Expert Syst. Appl.,2009

3. Quality-oriented optimization of wave soldering process by self-organizing maps;Liukkonen;Appl. Soft Comput.,2011

4. Development of lead-free wave soldering process;Arra;IEEE Trans. Electron. Packag. Manuf.,2002

5. Characterizing the temperature dependence of electronic packaging material properties;Fu;J. Met.,1995

Cited by 37 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal Assessment of Soldering MLCC Components;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

2. Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction;Journal of Electronic Materials;2023-12-12

3. Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material;Journal of Electronic Materials;2023-11-05

4. An Efficient Electrical-Thermal Co-Design Methodology for Analysis of High-Speed PCB Interconnects;2023 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO);2023-06-28

5. A study on the effect of the number of fin valleys on the thermal performance of a bus duct conductor;Numerical Heat Transfer, Part A: Applications;2023-03-13