Application of self-organizing maps in analysis of wave soldering process

Author:

Liukkonen M.,Havia E.,Leinonen H.,Hiltunen Y.

Publisher

Elsevier BV

Subject

Artificial Intelligence,Computer Science Applications,General Engineering

Reference16 articles.

1. Analyzing lead-free soldering defects in wave soldering using Taguchi methods. APEX 2000, Long Beach, March 14–16 2000;Diepstraten,2000

2. Directive 1999/13/EC (1999) Limitation of emissions of volatile organic compounds due to the use of organic solvents in certain activities and installations. European Council, March 11.

3. Directive 2002/95/EC (2003). Restriction of the use of certain hazardous substances in electrical and electronic equipment. European Council, January 27.

4. Fundamentals of modern manufacturing: Materials processes and systems;Groover,2004

5. Havia, E., Bernhardt, E., Mikkonen, T., Montonen, H. & Alatalo, M. (2005). Implementation of lead-free wave soldering process. In Proceedings of electronics production and packaging technology 2005, Pori, Finland.

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