Effects of Mo nanoparticles addition on the evolution of microstructure in Cu58Bi-xMo/Cu solder joints during aging-Reference-Cited by-同舟云学术

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Effects of Mo nanoparticles addition on the evolution of microstructure in Cu58Bi-xMo/Cu solder joints during aging

Published:2022-08 Issue: Volume:32 Page:104025
ISSN:2352-4928
Container-title:Materials Today Communications
language:en
Short-container-title:Materials Today Communications

Author:

Yang Linmei,Lu Xiaolong,Mu Guowan

Funder

National Natural Science Foundation of China

Department of Education of Liaoning Province

Publisher

Elsevier BV

Subject

Materials Chemistry,Mechanics of Materials,General Materials Science

Reference38 articles.

1. Sn-3.0Ag-0.5Cu/Sn58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology;Shen;Mater. Des.,2019

2. Effect of Ag-decorated MWCNT on the mechanical and thermal property of Sn58Bi solder joints for FCLED package;Lee;J. Mater. Sci. Mater. Electron.,2020

3. Aging resistance of the Sn-Ag-Cu solder joints doped with Mo nanoparticles;Yang;Mater. Lett.,2019

4. Solderability of SnBi-nano Cu solder pastes and microstructure of the solder joints;Liu;J. Mater. Sci. Mater. Electron.,2016

5. Microstructure and interface evolution of Sn-2.5Bi-1.4In-1Zn-0.3Ag/Cu joint during isothermal aging;Zhou;J. Mater. Sci. Mater. Electron,2013

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Al2O3 nanofibers reinforced Sn58Bi/SAC 305 hybrid joints for low temperature ball grid array bonding;Materials Today Communications;2024-03

2. Influence of Isothermal Aging on Microstructure and Shear Property of Novel Epoxy Composite SAC305 Solder Joints;Polymers;2023-10-20

3. Effect of Trace Boron Nitride Nanoparticles on the Microstructure and Shear Properties of Sn58Bi Solder Joint;Journal of Materials Engineering and Performance;2023-08-23

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