Funder
Semiconductor Research Corporation
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference20 articles.
1. Copper Wire Bonding;Chauhan,2014
2. Growth of CuAl intermetallic compounds in Cu and Cu(Pd) wire bonding;Lu,2011
3. Characterization of plastic encapsulant materials as a baseline for quality assessment and reliability testing;Lantz;Microelectron. Reliab.,2002
4. Electrochemical aspects of corrosion resistance and etching of metallizations for microelectronics;Comizzoli;Mater. Sci. Eng. A,1995
5. Crevice corrosion of ball bond intermetallics of Cu and Ag wire;Soestbergen,2016
Cited by
14 articles.
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