Author:
Lantz Leon,Hwang Seongdeok,Pecht Michael
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference20 articles.
1. Plastic encapsulated microelectronics;Pecht,1994
2. Quality conformance and qualification of microelectronic packages and interconnects;Pecht,1994
3. Plastic packaging of microelectronic devices;Manzione,1990
4. Epoxy molding compounds as encapsulation materials for microelectronic devices;Kinjo,1989
5. Powdered epoxy resin test methods;Hanssen;Proc. IEEE/CHMT IEMT Symp.,1998
Cited by
35 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献