Characterization of plastic encapsulant materials as a baseline for quality assessment and reliability testing-Reference-Cited by-同舟云学术

Characterization of plastic encapsulant materials as a baseline for quality assessment and reliability testing

Published:2002-08 Issue:8 Volume:42 Page:1163-1170
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Lantz Leon,Hwang Seongdeok,Pecht Michael

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference20 articles.

1. Plastic encapsulated microelectronics;Pecht,1994

2. Quality conformance and qualification of microelectronic packages and interconnects;Pecht,1994

3. Plastic packaging of microelectronic devices;Manzione,1990

4. Epoxy molding compounds as encapsulation materials for microelectronic devices;Kinjo,1989

5. Powdered epoxy resin test methods;Hanssen;Proc. IEEE/CHMT IEMT Symp.,1998

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