Electrochemical aspects of corrosion resistance and etching of metallizations for microelectronics-Reference-Cited by-同舟云学术

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Electrochemical aspects of corrosion resistance and etching of metallizations for microelectronics

Published:1995-07 Issue:1-2 Volume:198 Page:153-160
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Comizzoli R.B.,Frankenthal R.P.,Hanson K.J.,Konstadinidis K.,Opila R.L.,Sapjeta J.,Sinclair J.D.,Takahashi K.M.,Frank A.L.,Ibidunni A.O.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference13 articles.

1. Corrosion of Electronic Materials and Devices

2. Accelerated Life Testing of Electronic Devices by Atmospheric Particles: Why and How

3. The Rate of Dissolution and the Passivation of Titanium in Acids with Ammonium Fluoride Added

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Grain Boundary Engineering in Electrodeposited Tin-Carbon Nanotube Composite Coatings for Enhanced Corrosion Resistance Performance;Metallurgical and Materials Transactions A;2023-07-23

2. Effects of Temperature and Pd Concentration on the Corrosion Behavior of Pd-Doped Cu and Cu9Al4 at the Cu–Al Ball-Bond Interface;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-10

3. Galvanic corrosion behavior at the Cu-Al ball bond interface: Influence of Pd addition and chloride concentration;Microelectronics Reliability;2019-01

4. Corrosion-Induced Mass Loss of Cu9Al4 at the Cu-Al Ball–Bond Interface: Explained Based on Full Immersion of Cu, Al, and Cu-Al Intermetallic Galvanic Couples;Journal of Electronic Materials;2018-09-10

5. Theory of aluminum metallization corrosion in microelectronics;Electrochimica Acta;2010-07

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