Affiliation:
1. School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China
2. School of Chemical and Environmental Engineering, Jiaozuo University, Jiaozuo 454000, China
3. Nanjing High Speed Gear Manufacturing Co., Ltd., Nanjing 211100, China
Abstract
This paper provides a comprehensive review on copper (Cu) wire bonding. Firstly, it introduces the common types of Cu wire available in the market, including bare Cu wire, coated Cu wire, insulated Cu wire, and alloyed Cu wire. For each type, their characteristics and application areas are discussed. Additionally, we provide detailed insights into the impact of Free Air Ball (FAB) morphology on bonding reliability, including its effect on bond strength and formation mechanisms. Next, the reliability of Cu wire bonding is analyzed, with a focus on the impact of intermetallic compounds and corrosion on bonding reliability. Specifically, the formation, growth, and stability of intermetallic compounds at bonding interfaces are discussed, and their effects on bonding strength and reliability are evaluated. The detrimental mechanisms of corrosion on Cu wire bonding and corrosion inhibition methods are also analyzed. Subsequently, the applications of simulation in Cu wire bonding are presented, including finite element analysis and molecular dynamics simulations, which provide important tools for a deeper understanding of the bonding process and failure mechanisms. Finally, the current development status of Cu wire bonding is summarized, and future research directions are discussed.
Funder
Joint Funds of the National Natural Science Foundation of China
Key Science and Technology Program of Henan Province
Training Plan for Young Backbone Teachers in Higher Education Institutions of Henan Province
The Fundamental Research Funds for the Universities of Henan Province
Innovative Research Team of Henan Polytechnic University
Doctoral Fund of Henan Polytechnic University
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering
Reference87 articles.
1. Mainstream Bonded Copper Wire Semiconductor Packaging Technology for Microelectronic Packaging;Luo;Pract. Electron.,2022
2. Study on the Difference of Intermetalic Compounds between Cu-Al and Au-Al of Plastic Encapsulated Microelectronics in Repeated Hygrothermal;Chen;Electron. Qual.,2022
3. The Process and Reliability Researches of Copper Wire Bonding;Lu;Electron. Packag.,2010
4. The Developments and Challenges of Cu Bonding Wire;Wu;Electron. Prod. Reliab. Environ. Test.,2008
5. Critical study of thermosonic copper ball bonding;Srikanth;Thin Solid Film.,2004
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献