Author:
Wang Jing,Niu Yuling,Shao Shuai,Wang Huayan,Xu Jiefeng,Pham Vanlai,Park Seungbae
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference41 articles.
1. Effect of moisture on electrical properties and reliability of low dielectric constant materials;Cheng;Microelectron. Eng.,2014
2. An assessment of electromigration in 2.5D packaging;Xu,2019
3. The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging;Wong;J. Electron. Packag.,2002
4. Moisture and temperature effects on the reliability of interfacial adhesion of a polymer/metal interface;Ferguson,2004
5. Analysis of package cracking during reflow soldering process;Kitano,1988
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