1. Design, materials, process, fabrication, and reliability of fan-out wafer-level packaging;Lau;IEEE Trans. Compon. Packag. Manuf. Technol.,2018
2. A comprehensive study of crack initiation and delamination propagation at the Cu/polyimide interface in fan-out wafer level package during reflow process;Wang,2022
3. Ubando, Aristotle, and Jeremias Gonzaga. “Global-to-local finite element model of shear stress analysis on Fan-out wafer-level package.” 2022 IEEE 14th International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment, and Management (HNICEM). IEEE, 2022.
4. Fundamentals of microsystems packaging. McGraw-Hill;Tummala;Education,2001
5. Electrical and reliability investigation of Cu-to-Cu bonding with silver passivation layer in 3-D integration;Chou;IEEE Trans. Compon. Packag. Manuf. Technol.,2020