Author:
Saritas R.,Khater M.,Park S.,Dagdelen T.,Abdel-Rahman E.,Yavuz M.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference17 articles.
1. Unconventional applications of wire bonding create opportunities for microsystem integration;Fischer;J. Micromech. Microeng.,2013
2. In situ studies of the effect of ultrasound during deformation on residual hardness of a metal;Lum;J. Electron. Mater.,2009
3. Reliability and life time evaulation of different wire bonding technologies for high power IGBT modules;Hamidi;Microelectron. Reliab.,1999
4. Thermal fatigue life evaluation of aluminum wire bonds, electronics systemintegration technology conference;Matsunaga;IEEE,2006
5. Mechanical fatigue properties of heavy aluminium wire bonds for power applications, proceedings - 2008 2nd electronics systemintegration technology conference, ESTC;Merkle,2008
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