Author:
Lum I.,Hang C. J.,Mayer M.,Zhou Y.
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference19 articles.
1. G.G. Harman, Wire Bonding in Microelectronics—Materials, Processes, Reliability, and Yield 2nd Edition, (New York: McGraw Hill, 1997)
2. J. Chen, D. Degryse, P. Ratchev, I. DeWolf, IEEE Trans. Compon. Pack. Technol., 27, 539 (2004)
3. M. Sheaffer, L.R. Levine, and B. Schlain, IEEE Trans. Compon. Hybrd. CHMT-10, 321 (1986).
4. D. Degryse, B. Vandevelde, and E. Beyne, Proceedings of the 54th Electronic Components and Technology Conference, Vol. 1 (2004), p. 906.
5. S. Kaimori, T. Nonaka, A. Mizoguchi, IEEE Trans. Adv. Pack. 29, 227 (2006)
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