1. M. Tarr, “Bonding to the chip face.”
2. T. K. Lee, C. D. Breach, and W. L. Chong, “Comparsion of Au/Al and Cu/Al in wirebonding assembly and reliability,” in Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International, 2011, pp. 234–237.
3. Y. Jiang, R. Sun, Y. Yu, and Z. Wang, “Study of 6 mil Cu wire replacing 10-15 mil Al wire for maximizing wire-bonding process on power ICs,” Electronics Packaging Manufacturing, IEEE Transactions on, vol. 33, pp. 135–142, 2010.
4. F. W. Wulff, C. D. Breach, D. Stephan, Saraswati, and K. J. Dittmer, “Characterisation of intermetallic growth in copper and gold ball bonds on aluminium metallization,” in Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th, 2004, pp. 348–353.
5. A. Shah, M. Mayer, Y. Zhou, S. J. Hong, and J. T. Moon, “Reduction of underpad stress in thermosonic copper ball bonding,” in Electronic Components and Technology Conference, 2008. ECTC 2008. 58th, 2008, pp. 2123-2130.