A methodology to calculate the equivalent static loading for simulating electronic assemblies under impact

Author:

Gharaibeh Mohammad A.,Pitarresi James M.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference45 articles.

1. Vibration Analysis for Electronic Equipment;Steinberg,1988

2. Cooling Techniques for Electronic Equipment;Steinberg,1980

3. Proposed Recommended Practices in Applying Broadband Vibration Screening to Electronic Hardware;Silver,1981

4. Accelerated vibration reliability testing of electronic assemblies using sine dwell with resonance tracking;Su;J. Electron. Packag.,2018

5. System level mechanical shock reliability of BGA packages: experimental and numerical analysis;Gu,2017

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2. Nonlinear finite element simulations on the mechanical response of the isothermally aged lead-free solders;Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications;2023-06-02

3. An efficient equivalent static methodology for simulating electronic packages subjected to resonant vibrations;Microelectronics Reliability;2023-06

4. Drop and impact reliability investigation of BGA and LGA interconnects;Soldering & Surface Mount Technology;2023-05-11

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