Finite-element stress and strain analysis of tin–silver–copper solders exposed to isothermal ageing at 100° C
Author:
Affiliation:
1. Department of Mechanical Engineering, Faculty of Engineering, The Hashemite University, Zarqa, Jordan
Publisher
Informa UK Limited
Link
https://www.tandfonline.com/doi/pdf/10.1080/09507116.2024.2368866
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3. Ma H, Suhling JC, Zhang Y, et al. 2007 Proceedings 57th Electronic Components and Technology Conference; 2007, May. The influence of elevated temperature aging on reliability of lead free solder joints. (pp. 653–668). IEEE. doi: 10.1109/ECTC.2007.373867
4. Optimization of Dwell and Ramp Times for SAC305 Solder Thermal Cycling Fatigue Life for Testing and Real-Life Applications
5. Zhang Y, Cai Z, Suhling JC, et al. In 2009 59th Electronic Components and Technology Conference; 2009, May. The effects of SAC alloy composition on aging resistance and reliability. (pp. 370–389). IEEE. doi: 10.1109/ECTC.2009.5074043
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