The effects of aging temperature on SAC solder joint material behavior and reliability-Reference-Cited by-同舟云学术

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The effects of aging temperature on SAC solder joint material behavior and reliability

Published:2008-05 Issue: Volume: Page:
ISSN:
Container-title:2008 58th Electronic Components and Technology Conference
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Author:

Yifei Zhang ,Zijie Cai ,Suhling Jeffrey C.,Lall Pradeep,Bozack Michael J.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4542565/4549927/04549956.pdf?arnumber=4549956

Cited by 70 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Solder joint reliability performance study and shear characterization of low-Ag SAC lead-free solders for handheld application;Materials Science in Semiconductor Processing;2024-08

2. Finite-element stress and strain analysis of tin–silver–copper solders exposed to isothermal ageing at 100° C;Welding International;2024-06-24

3. Effect of Creep, Fatigue and Random Vibration on the Integrity of Solder Joints in BGA Package;Microelectronics Reliability;2024-06

4. Correlation of Mechanical and Microstructural Evolutions in Lead Free Solders Subjected to Various Thermal Exposures;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

5. Numerical Characterization of the Mechanical Performance of SAC105 Tin-Silver-Copper Solder Interconnections After Aging;Annales de Chimie - Science des Matériaux;2023-12-22

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