The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints-Reference-Cited by-同舟云学术

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The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints

Published:2007 Issue: Volume: Page:
ISSN:
Container-title:2007 Proceedings 57th Electronic Components and Technology Conference
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Author:

Ma Hongtao,Suhling Jeffrey C.,Zhang Yifei,Lall Pradeep,Bozack Michael J.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4249837/4249838/04249953.pdf?arnumber=4249953

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Finite-element stress and strain analysis of tin–silver–copper solders exposed to isothermal ageing at 100° C;Welding International;2024-06-24

2. Nonlinear finite element simulations on the mechanical response of the isothermally aged lead-free solders;Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications;2023-06-02

3. High-Reliability Lead-Free Solders for Automotive Electronics;SAE Technical Paper Series;2023-05-25

4. Exploring Zn doped η′‐Cu₆Sn₅: Structural stability, fracture toughness and thermal conductivity;International Journal of Quantum Chemistry;2023-03-23

5. Effect of Aging Temperature on the Fatigue Resistance and Shear Strength of SAC305 Solder Joints;IEEE Transactions on Device and Materials Reliability;2022-06

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