Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnects-Reference-Cited by-同舟云学术

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Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnects

Published:2017-10 Issue: Volume:722 Page:746-752
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Liu Li,Chen Zhiwen,Zhou Zhaoxia,Chen Guang,Wu Fengshun,Liu Changqing

Funder

Marie Curie International Research Staff Exchange Scheme Project

EPSRC-CPB

National Nature Science Foundation of China

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference31 articles.

1. High lead solder (over 85%) solder in the electronics industry: RoHS exemptions and alternatives;Menon;J. Mater. Sci. Mater. Electron.,2015

2. Die attach materials for high temperature applications: a review;Manikam;IEEE Trans. Compon. Packag. Manuf. Technol.,2011

3. Development of Au–Ge based candidate alloys as an alternative to high-lead content solders;Chidambaram;J. Alloys Compd.,2010

4. Characteristics and properties of Bi-11Ag solder;Koleňák;Solder. Surf. Mt. Technol.,2013

5. Power modules die attach: a comprehensive evolution of the nanosilver sintering physical properties versus its porosity;Youssef;Microelectron. Reliab.,2015

Cited by 18 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mechanical property of intermetallic compounds in Zn–Al solder interconnects by nanoindentation and first-principles calculations;Intermetallics;2024-09

2. Effect of Indium on Microstructures and Mechanical Properties of Bismuth-Based High Temperature Solders;MATERIALS TRANSACTIONS;2024

3. Deposition behavior of electroless Ni‐W‐P coating on Zr‐4 surface;Vietnam Journal of Chemistry;2023-06-21

4. Microstructure, shear properties and corrosion resistance of Cu/Cu-In/Cu solder joints;Journal of Advanced Joining Processes;2022-06

5. Akımsız Kaplama Yöntemi ile Üretilen Ni-W-P Çoklu Alaşımların Sertlik ve Aşınma Özelliklerine Sodyum Tungsten İçeriğinin Etkisi;European Journal of Science and Technology;2022-03-02

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