Akımsız Kaplama Yöntemi ile Üretilen Ni-W-P Çoklu Alaşımların Sertlik ve Aşınma Özelliklerine Sodyum Tungsten İçeriğinin Etkisi
Author:
Publisher
European Journal of Science and Technology
Subject
General Earth and Planetary Sciences,General Environmental Science
Reference20 articles.
1. Balaraju, J. N., Kalavati, & Rajam, K. S. (2009). Surface morphology and structure of electroless ternary NiWP deposits with various W and P contents. Journal of Alloys and Compounds, 486(1–2), 468–473. https://doi.org/10.1016/J.JALLCOM.2009.06.173
2. Balaraju, J. N., Kalavati, & Rajam, K. S. (2010). Electroless ternary Ni-W-P alloys containing micron size Al2O3 particles. Surface and Coatings Technology, 205(2), 575–581. https://doi.org/10.1016/j.surfcoat.2010.07.047
3. Balaraju J N, Kalavati N T, M. et al. (2012). ,. Surface and Coatings Technology[J], 206: 2682.
4. Brenner, A., & Riddell, G. E. (1998). Nickel Plating on Steel by Chemical Reduction. Plating and Surface Finishing, 85(8), 54–56. https://doi.org/10.6028/jres.037.019
5. Chen, K., Liu, C., Whalley, D. C., Hutt, D. A., Li, J. F., & Mannan, S. H. (2006). Electroless Ni-W-P alloys as barrier coatings for liquid solder interconnects. ESTC 2006 - 1st Electronics Systemintegration Technology Conference, 1, 421–427. https://doi.org/10.1109/ESTC.2006.280037
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