Development of Au–Ge based candidate alloys as an alternative to high-lead content solders
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference17 articles.
1. Alloy design of Zn–Al–Cu solder for ultra high temperatures
2. Pb-free high temperature solders for power device packaging
3. High-temperature lead-free solders: Properties and possibilities
4. Development of gold based solder candidates for flip chip assembly
5. A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications
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