Alloy design of Zn–Al–Cu solder for ultra high temperatures-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Alloy design of Zn–Al–Cu solder for ultra high temperatures

Published:2009-01 Issue:1-2 Volume:467 Page:246-250
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Kang Namhyun,Na Hye Sung,Kim Seong Jun,Kang Chung Yun

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference11 articles.

1. Proceedings of the 2nd International High Temperature Electronics Conference;Carlin,1994

2. High-Temperature Electronics;Brown,1999

3. O. Vermesan, L.-C. Blystad, SINTEF Report, STF72F02619, Oslo, Norway, 2002.

4. Proceedings of the 1st International High Temperature Electronics Conference;Veneruso,1991

5. High-temperature electronics - a role for wide bandgap semiconductors?

Cited by 97 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Al Content on the Microstructure and Properties of Zn-Al Solder Alloys;Metals;2024-06-11

2. Synthesis and Characterization of Zn-xFe high Temperature Solder Alloy;Materials Today: Proceedings;2024-05

3. Characterization of an Active Soldering Zn-Mg Alloy and the Study of Ultrasonic Soldering of SiC Ceramics with Copper Substrate;Applied Sciences;2024-02-13

4. Structural, thermal and mechanical properties of rapidly solidified Bi-0.5Ag lead-free solder reinforced Tb rare-earth element for high performance applications;Soldering & Surface Mount Technology;2024-02-09

5. First principles modeling of mechanical properties of binary alloys containing Ga, Sn, and In for soldering applications;Journal of Physics: Condensed Matter;2023-09-06

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3