Author:
Chidambaram Vivek,Hald John,Hattel Jesper
Abstract
An attempt has been made to determine the lead free ternary combinations that satisfied the solidification requirement for a solder used in level 1 packaging applications, using the CALPHAD approach. The segregation profiles of the promising candidates were analyzed after scrutinizing the equilibrium calculations by Scheil solidification simulations and optimization. A feasibility study has been carried out for the replacement of high-lead-containing solders with the focus on surface tension, natural radius of curvature, oxidation resistance, intermetallic compound formation, and environmental oriented issues.
Publisher
IMAPS - International Microelectronics Assembly and Packaging Society
Subject
Electrical and Electronic Engineering,Computer Networks and Communications,Electronic, Optical and Magnetic Materials
Cited by
4 articles.
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