Design of lead-free candidate alloys for high-temperature soldering based on the Au–Sn system
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,General Mathematics
Reference14 articles.
1. High-temperature lead-free solders: properties and possibilities;Suganuma;JOM,2009
2. Thermodynamics aided alloy design and evaluation of Pb-free solders for high-temperature applications;Kim;Mater Trans, JIM,2002
3. Development of Au–Ge based candidate alloys as an alternative to high-lead content solders;Chidambaram;J Alloys Compd,2009
4. A feasibility study of lead free solders for level 1 packaging applications;Chidambaram;J Microelectron Electron Pack,2009
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