Study of electromigration in Sn-Ag-Cu micro solder joint with Ni interfacial layer-Reference-Cited by-同舟云学术

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Study of electromigration in Sn-Ag-Cu micro solder joint with Ni interfacial layer

Published:2021-05 Issue: Volume:862 Page:158043
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Madanipour Hossein,Kim Yi-Ram,Kim Choong-Un,Mishra Dibyajat,Thompson Patrick

Funder

Semiconductor Research Corporation

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference31 articles.

1. Transition from flip chip solder joint to 3D IC microbump: its effect on microstructure anisotropy;Tu;Microelectron. Reliab.,2013

2. Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology;Tu;Mater. Sci. Eng. R Rep.,2019

3. M.Y. Kim, L.S. Chen, S.H. Chae, C.U. Kim, Mechanism of void formation in Cu post solder joint under electromigration, In: Proceedings of the IEEE 64th Electronics Components and Technological Conference, 2015: pp. 135–141. https://doi.org/10.1109/ECTC.2015.7159582.

4. Intermetallic compounds in 3D integrated circuits technology: a brief review;Annuar;Sci. Technol. Adv. Mater.,2017

5. Fracture reliability concern of ( Au, Ni) Sn 4 phase in 3D integrated circuit microbumps using Ni / Au surface fi nishing;Liu;Scr. Mater.,2016

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1. Micro-nano interface structure and mechanical characteristics of thin wall Cu/Al composite tubes prepared by strong staggered spinning;Materials Characterization;2023-12

2. Wetting behavior and mechanical properties of Sn-10Sb solder/Ni-plated Cu system with different surface structures;Vacuum;2023-11

3. Experimental and multiphysics simulation study of atoms migration and morphology evolution in solder joints under high current density;International Journal of Heat and Mass Transfer;2023-03

4. The Study of the Reliability of Complex Components during the Electromigration Process;Micromachines;2023-02-21

5. Effects of GNSs addition on the electromigration of Sn58Bi and Cu-core Sn58Bi joint;Journal of Materials Science;2022-08

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