Mechanism of void formation in Cu post solder joint under electromigration
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7133058/7159553/07159582.pdf?arnumber=7159582
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Study of Metallurgical Reaction and Electromigration Mechanism in Microbump with Embedded Cu Ball;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06
2. Study of electromigration in Sn-Ag-Cu micro solder joint with Ni interfacial layer;Journal of Alloys and Compounds;2021-05
3. Effect of Intermetallic Compound Growth on Electromigration Failure Mechanism in Low-Profile Solder Joints;2019 IEEE 69th Electronic Components and Technology Conference (ECTC);2019-05
4. Intermetallic compounds in 3D integrated circuits technology: a brief review;Science and Technology of Advanced Materials;2017-09-28
5. Surface diffusion induced shape evolution of multiple circular voids under high current density;Journal of Applied Physics;2017-05-28
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