Surface diffusion induced shape evolution of multiple circular voids under high current density-Reference-Cited by-同舟云学术

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Surface diffusion induced shape evolution of multiple circular voids under high current density

Published:2017-05-28 Issue:20 Volume:121 Page:205111
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Wang Yuexing¹^ORCID,Yao Yao¹,Keer Leon M.²

Affiliation:

1. School of Mechanics and Civil Engineering, Northwestern Polytechnical University, Xi'an 710072, People's Republic of China

2. Department of Civil and Environmental Engineering, Northwestern University, 2145 Sheridan Rd., Evanston, Illinois 60208, USA

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.4984319

Reference25 articles.

1. Failure mechanisms of solder interconnects under current stressing in advanced electronic packages

2. Overview no. 2

3. Electromigration-induced void drift and coalescence: Simulations and a dynamic scaling theory

4. Über die von der molekularkinetischen Theorie der Wärme geforderte Bewegung von in ruhenden Flüssigkeiten suspendierten Teilchen

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Current-induced solder evolution and mechanical property of Sn-3.0Ag-0.5Cu solder joints under thermal shock condition;Journal of Alloys and Compounds;2024-01

2. Effect of the anisotropic characteristics of β-Sn on current-induced solder evolution;Materials & Design;2022-12

3. Thermal conductivity and Lorenz ratio of metals at intermediate temperatures with mode-level first-principles analysis;Physical Review B;2020-11-10

4. Phase-Field Study of Electromigration-Induced Shape Evolution of a Transgranular Finger-Like Slit;Journal of Electronic Materials;2018-08-31

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