Effect of Intermetallic Compound Growth on Electromigration Failure Mechanism in Low-Profile Solder Joints-Reference-Cited by-同舟云学术

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Effect of Intermetallic Compound Growth on Electromigration Failure Mechanism in Low-Profile Solder Joints

Published:2019-05 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
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Author:

Madanipour H.,Kim Y.R.,Kim Choong-Un,Shahane N.,Mishra D.,Noguchi T.,Yoshino M.,Nguyen L.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8795274/8811008/08811324.pdf?arnumber=8811324

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. An Electromigration Study of Cu Pillar Interconnects in Flip-chip QFN Packaging under Extreme Conditions for High-power Applications;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

2. Study of Metallurgical Reaction and Electromigration Mechanism in Microbump with Embedded Cu Ball;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

3. Study of electromigration in Sn-Ag-Cu micro solder joint with Ni interfacial layer;Journal of Alloys and Compounds;2021-05

4. Solder Joints in PCB Assembly and Semiconductor Packaging;Assembly and Reliability of Lead-Free Solder Joints;2020

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