Fracture reliability concern of (Au, Ni)Sn 4 phase in 3D integrated circuit microbumps using Ni/Au surface finishing-Reference-Cited by-同舟云学术

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Fracture reliability concern of (Au, Ni)Sn 4 phase in 3D integrated circuit microbumps using Ni/Au surface finishing

Published:2016-07 Issue: Volume:119 Page:9-12
ISSN:1359-6462
Container-title:Scripta Materialia
language:en
Short-container-title:Scripta Materialia

Author:

Liu Yingxia,Chen Yi-Ting,Gu Sam,Kim Dong-Wook,Tu K.N.

Funder

Qualcomm

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering

Reference19 articles.

1. IEEE International Electron Devices Meeting;Gu,2008

2. IEEE Electronic Components and Technology Conference;Kim,2013

3. IEEE Electronic Components and Technology Conference;Liu,2014

4. Electronic Components and Technology Conference;Liu,2015

5. Electronic Components and Technology Conference;Wang,2015

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