Study on Reliability of Hard-Lap Solder Joints of Microwave RF Coaxial Connectors-Reference-Cited by-同舟云学术

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Study on Reliability of Hard-Lap Solder Joints of Microwave RF Coaxial Connectors

Published:2023-08-08 Issue: Volume: Page:1-5
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Xiaowei Sun¹,Geng Li²,Wenyu Wu¹

Affiliation:

1. No.38 Research Institute,Hefei,China,230031

2. Harbin Institute of Technology,Harbin,China,150001

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492137.pdf?arnumber=10492137

Reference2 articles.

1. Reliability of BGA Solder Joints on the Au/Ni/Cu Bond Pad-Effect of Thicknesses of Au and Ni Layer

2. Fracture reliability concern of (Au, Ni)Sn 4 phase in 3D integrated circuit microbumps using Ni/Au surface finishing

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