The effect of crosshead speed on the joint strength between Sn-Zn-Bi lead-free solders and Cu substrate-Reference-Cited by-同舟云学术

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The effect of crosshead speed on the joint strength between Sn-Zn-Bi lead-free solders and Cu substrate

Published:2007-06 Issue:1-2 Volume:436 Page:112-117
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Mayappan Ramani,Ismail Ahmad Badri,Ahmad Zainal Arifin,Ariga Tadashi,Hussain Luay Bakir

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference18 articles.

1. Lead-free Solders in Microelectronics

2. Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates

3. The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements

4. Strength of bonding interface in lead-free Sn alloy solders

5. Effect of composition and cooling rate on microstructure and tensile properties of Sn–Zn–Bi alloys

Cited by 29 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microstructure Evolution and Shear Strength Study of Sn–9Zn and Sn–8Zn–3Bi on Cu Substrate;Transactions on Electrical and Electronic Materials;2023-10-17

2. Effects of Bismuth on the Microstructure, Properties, and Interfacial Reaction Layers of Sn-9Zn-xBi Solders;Metals;2021-03-26

3. Effect of cooling rates on contact angle, joint strength and intermetallic of Sn-9Zn solder alloy;4TH INTERNATIONAL SCIENCES, TECHNOLOGY AND ENGINEERING CONFERENCE (ISTEC) 2020: Exploring Materials for the Future;2021

4. On the mechanism of Sn tunnelling induced intermetallic formation between Sn-8Zn-3Bi solder alloys and Cu substrates;Journal of Alloys and Compounds;2019-06

5. Tin Whisker Growth Inhibition in RE-Doped Sn-Zn Soldered Joints;Applied Sciences;2019-04-03

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