Author:
Kikuchi S,Nishimura M,Suetsugu K,Ikari T,Matsushige K
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference4 articles.
1. Lead‐free Solders for Electronic Packaging and Assembly
2. Creep in Metallic Materials.;Cadek,1988
3. Rate Processes in Plastic Deformation of Materials;Frost,1975
4. Metal;Sunwood;Trans.,1991
Cited by
41 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献