Author:
Xue Peng,Liang Weiliang,He Peng,Suganuma Katsuaki,Zhang Hao
Abstract
The tin whisker inhibition in RE-doped Sn-Zn soldered joints was investigated. The results indicated that after aging treatment at 150 °C, with the proper addition ratio of Ga and Nd, no obvious NdSn3 phase nor tin whisker growth was observed in the soldered joints. By replacing the Sn-Nd phase with a Ga-Nd phase, the risk of tin whisker growth caused by the oxidation of RE-phase was significantly inhibited even in soldered joints with additional excessive contents of Nd. The IMC layer in soldered joints with optimal addition showed a relatively regular shape after aging treatment, making the soldered joint maintain preferable mechanical performance. The results would be available for guiding the study of tin whisker growth inhibition method.
Funder
National Natural Science Foundation of China
Subject
Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science
Cited by
4 articles.
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