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Thermal property, wettability and interfacial characterization of novel Sn–Zn–Bi–In alloys as low-temperature lead-free solders

  • Published:2015-11 Issue: Volume:84 Page:331-339
  • ISSN:0264-1275
  • Container-title:Materials & Design
  • language:en
  • Short-container-title:Materials & Design

Author:

Liu Jian-Chun,Zhang Gong,Wang Zheng-Hong,Ma Ju-Sheng,Suganuma Katsuaki

Funder

Grant-in-Aid for Scientific Research

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference31 articles.

1. Lead-free solders in microelectronics;Abtew;Mater. Sci. Eng. R,2000

2. Advances in lead-free electronics soldering;Suganuma;Curr. Opin. Solid State Mater. Sci.,2001

3. Sn–Zn low temperature solder;Suganuma,2007

4. Oxidation behavior of Sn–Zn solders under high-temperature and high-humidity conditions;Jiang;J. Alloys Compd.,2008

5. The role of Zn precipitates and Cl− anions in pitting corrosion of Sn–Zn solder alloys;Liu;Corros. Sci.,2015

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