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The role of Zn precipitates and Cl− anions in pitting corrosion of Sn–Zn solder alloys

  • Published:2015-03 Issue: Volume:92 Page:263-271
  • ISSN:0010-938X
  • Container-title:Corrosion Science
  • language:en
  • Short-container-title:Corrosion Science

Author:

Liu Jian-Chun,Park SungWon,Nagao Shijo,Nogi Masaya,Koga Hirotaka,Ma Ju-Sheng,Zhang Gong,Suganuma Katsuaki

Funder

JSPS Grant-in-Aid for Scientific Research

Publisher

Elsevier BV

Subject

General Materials Science,General Chemical Engineering,General Chemistry

Reference49 articles.

1. Lead-free solders in microelectronics;Abtew;Mater. Sci. Eng.: R: Rep.,2000

2. Advances in lead-free electronics soldering;Suganuma;Curr. Opin. Solid State Mater. Sci.,2001

3. Properties of lead-free solder alloys with rare earth element additions;Wu;Mater. Sci. Eng.: R: Rep.,2004

4. Sn–Zn low temperature solder;Suganuma,2007

5. Oxidation behavior of Sn–Zn solders under high-temperature and high-humidity conditions;Jiang;J. Alloy. Compd.,2008
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