The role of delayed elasticity and stress relaxation in Sn-Bi-Cu lead-free solders solidified under permanent magnet stirring
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference26 articles.
1. Surface finish effect on reliability of SAC 305 soldered chip resistors
2. Alloying influences on low melt temperature SnZn and SnBi solder alloys for electronic interconnections
3. Reinforcement of graphene nanosheets on the microstructure and properties of Sn58Bi lead-free solder
4. Effect of In on microstructure, thermodynamic characteristic and mechanical properties of Sn–Bi based lead-free solder
Cited by 16 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Experimental study and numerical simulation of permanent magnet stirring on solidification of IN718 superalloy under different rotation speeds;Journal of Alloys and Compounds;2023-09
2. Numerical Simulation and Experimental Study of Molten Steel Permanent Magnet Stirring Under Different Rotation Speeds and Magnetic Flux Densities;Metallurgical and Materials Transactions B;2023-04-11
3. Combination of enhanced strength-ductility trade-off and stress relaxation resistance of MWCNTs reinforced Sn–5Sb-0.3Cu matrix composite;Materials Chemistry and Physics;2023-02
4. Impact of rotating magnetic field on the microstructure, thermal properties, and creep behavior during the solidification of Sn–2.0Ag–0.5Cu solder alloy;Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications;2022-07-06
5. Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review;Soldering & Surface Mount Technology;2022-04-04
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