Effect of cooling rates on contact angle, joint strength and intermetallic of Sn-9Zn solder alloy
Author:
Publisher
AIP Publishing
Link
http://aip.scitation.org/doi/pdf/10.1063/5.0043379
Reference13 articles.
1. Reliability study of industry Sn3.0Ag0.5Cu/Cu lead-free soldered joints in electronic packaging
2. The microstructure and mechanical properties of Zn-25Sn-XAl (X=0–0.09wt%) high temperature lead free solder
3. Effect of sample perimeter and temperature on Sn–Zn based lead-free solders
4. Effect of Bi addition on the activation energy for the growth of Cu5Zn8 intermetallic in the Sn–Zn lead-free solder
5. A review on the effect of surface finish and cooling rate on solder joint reliability
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