Author:
Mayappan Ramani,Ismail Ahmad Badri,Ahmad Zainal Arifin,Ariga Tadashi,Hussain Luay Bakir
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
18 articles.
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1. Effect of indium addition on mechanical, thermal, and soldering properties of eutectic Sn–9Zn alloy;Materials Chemistry and Physics;2024-03
2. Microstructure Evolution and Shear Strength Study of Sn–9Zn and Sn–8Zn–3Bi on Cu Substrate;Transactions on Electrical and Electronic Materials;2023-10-17
3. Bi-Sn-Zn Ternary Phase Diagram Evaluation;MSI Eureka;2021-12-30
4. Effect of cooling rates on contact angle, joint strength and intermetallic of Sn-9Zn solder alloy;4TH INTERNATIONAL SCIENCES, TECHNOLOGY AND ENGINEERING CONFERENCE (ISTEC) 2020: Exploring Materials for the Future;2021
5. Reference Data for the Density, Viscosity, and Surface Tension of Liquid Al–Zn, Ag–Sn, Bi–Sn, Cu–Sn, and Sn–Zn Eutectic Alloys;Journal of Physical and Chemical Reference Data;2018-03