Effect of rare earth element addition on the microstructure of Sn-Ag-Cu solder joint-Reference-Cited by-同舟云学术

Effect of rare earth element addition on the microstructure of Sn-Ag-Cu solder joint

Published:2005-03 Issue:3 Volume:34 Page:217-224
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Li Bo,Shi Yaowu,Lei Yongping,Guo Fu,Xia Zhidong,Zong Bin

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-005-0207-1.pdf

Reference18 articles.

1. D.R. Frear, Electron. Information Techn. 118, 81 (2001).

2. S. Grum, Electron. Packing Production 40, 13 (2000).

3. B.P. Richards, C.L. Levoguer, and K. Nimmo, An Analysis of the Current Status of Lead-Free Soldering (United Kingdom: Department of Trade and Industry, 1999).

4. Tupl Chanyc Laijkl, IEEE Trans. CPMT Part B 20, 87 (1997).

5. Tupl Chanyc Laijkl, IEEE Trans. CPMT Part B 20, 463 (1997).

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