Author:
Kasumov Yu N,Kutuev R A,Manukyants A R,Sozaev V A
Abstract
Abstract
This paper presents the results of the surface properties of the tin-based melts. It has been shown that the best wetting of Al-4 at. % Li grade aluminum, silicon, and piezoceramics are achieved by the eutectics and terectics of tin-aluminum, tin-zinc, and aluminum alloys, respectively. Preliminary photon annealing of the substrates for 3–4 sec improves the wetting of silicon and ceramics. Solder wetting is also improved by the addition of copper and nickel micro powders, alkaline, and alkaline earth elements.
Reference59 articles.
1. Sn-Sb and Sn-Bi Alloys as Anode Materials for Lithium-Ion Batteries;Trifonova;Ionics,2002
2. Sn-Zn Low Temperature Solder;Suganuma;J. Mater. Sci: Mater Electro,2007
3. Primary Solidification Phases of the Sn-Rich Sn-Ag-Cu-Ni Quaternary System;Chang;J. of Electr. Mater.,2005
4. Anderson Development of Sn-Ag-Cu and Sn-Ag-Cu-X Alloys for Pb-free Electronic Solder Applications;Iver;J. Mater Sci: Mater Electron,2007
5. Effect of Rare Earth Element Addition on the Microstructure of Sn-Ag-Cu Solder Joint;Bo;J. of Electr. Mater.,2005