Investigation of interfacial reactions between Sn–5Bi solder and Cu substrate
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference21 articles.
1. P.T. Vianco, F.J. Yost, Sandia Report, SAND 92-0211, Sandia Nat. Lab., April (1992) 1.
2. The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders
3. Metallurgy of low temperature Pb-free solders for electronic assembly
4. Thermodynamic analysis of influence of Pb contamination on Pb-free solder joints reliability
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