Microstructure evolution and mechanical properties changes during the formation of full Cu41Sn11 joint in high-temperature electronic packaging-Reference-Cited by-同舟云学术

Microstructure evolution and mechanical properties changes during the formation of full Cu41Sn11 joint in high-temperature electronic packaging

Published:2022-03 Issue: Volume:130 Page:114481
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Yang Gangli,Li Xiaoyan,Han Xu,Zhang Hu,Wen Linjie,Li Shanshan

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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